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- AS 9100 Certified
- (NADCAP Certified *Anticipated 2010)
- Lockheed Martin Certified
Electro-Spec has been a supplier to many of the world’s leading aerospace companies
for years. Involved in several new and cutting edge technologies, we have been privileged
to plate parts that have gone into the Mar’s Rover, Star War’s Defense systems,
spy satellites, Space Shuttles and many other space applications.
We are a preferred plating vendor for “Hi-Reliability” applications that require
100% conformity and zero rejects.
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Electro-Spec is a supplier on many different types of medical components. From micro-electronic
medical components, to implantable components to bio-hazard/germicidal components,
Electro-Spec is a partner in both new technologies and new product development.
We have the ability to meet many of the most stringent specifications in the medical
industry, with indefinite traceability for all processes that we do.
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Electro-Spec has been a leading plating supplier to many of the world’s top Tier
I and Tier II automotive companies. We have been involved in several new developments
that have had significant benefits with regard to technology and cost reductions
over previous applications. We have successfully converted many different methods
and processes that have impacted Ford, GM and Chrysler on safety critical components.
Employing a variety of Six Sigma, Kaizan, Black Belt and SPC into these conversions,
we stand prepared to tackle even the most difficult PPAP’s and APQP’s with a sound
and methodical approach to meeting and exceeding your requirements.
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Electro-Spec has been involved with the RF/Microwave industry for over 40 years.
Starting as a plating supplier to “Specialty Connector Company” many years ago,
Electro-Spec has had the privilege of being a supplier to many of the world’s leading
telecommunication companies. Understanding the need for precision plating, exact
tolerances, consistent/uniform plating coverage and non-magnetic finishes is something
that is built into all of our plating processes.
These processes are predicated on reducing RF loss, improving “skin effect”, and
minimizing intermodulation interference to facilitate and improve signal transmission.
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