Spouted Bed Electrode Plating
At Electro-Spec, Inc. we specialize in employing innovative methods, such as Spouted Bed Electrode (SBE), which allow us to provide plating service for a wide range of industries and applications.
This process is designed exclusively for gold, nickel, electroless nickel, and copper plating. The SBE process is ideal suited for small parts with features such as flat surfaces, counter bores, tabs, nested parts, or complex geometries. This makes it the perfect process for parts where vibratory or conventional barrel plating is impossible or impractical.
The SBE process is accomplished in a chamber with ultrasonic action; a continuous flow of solution is pumped into and out of the chamber. This facilitates part movement and provides fresh plating electrolyte during the plating process. It ensures that each part receives uniform plating coverage on all surface areas no matter how complex the geometry.
To learn more about Spouted Bed Electrode plating, contact us directly.
Additional Information about Spouted Bed Electrode Plating
Spouted Bed Electrode (SBE) Plating
Spouted Bed Electrode (SBE) plating is the newest plating technology in the industry and has been the catalyst for drastically smaller electronic components. Without SBE plating, micro-electronics would still be science fiction.
SBE plating is successful for parts that have dimensions smaller than 1 cm in any single dimension. This process is ideal for small parts, flat parts, parts with tabs, parts with counter bores, parts that nest, or parts that have difficult geometries. Unlike traditional barrel plating, SBE plating eliminates uneven plating or small parts fouling.
The plating process occurs in a conical chamber with ultrasonic action, unlike the rotating drum used in barrel plating. By continuously pumping solution into and out of the conical chamber, small parts are gently moved through fresh plating electrolyte and directed toward the sidewall of the vessel. This high-quality plating process reduces defects and improves corrosion resistance and conductivity because there are no solution-introduction restrictions as there are in barrel plating.
There are numerous advantages of SBE plating over barrel plating. SBE plating offers a higher quality coating and improved part-to-part thickness distribution due to the continuous and rapid introduction of the solution into the chamber. The resulting parts are uniformly plated with coverage in high and low current density areas as well as in counter bores.
Since there are no moving parts in the SBE process, there is no issue with parts being trapped—no matter the size of the parts. The rapidly moving parts do not have an opportunity to tangle, clump, nest, or become damaged. Part contamination is also dramatically reduced because rinse water is introduced through the same high speed jets that circulate the electrolytic solutions. These units have the ability to be easily moved to customize plating lines.
This system of plating also offers major cost-effectiveness when working with metal platings like gold, palladium, nickel, electroless nickel, and copper. The parts are moved quickly through the high-velocity jet of electrolytic solution that rapidly improves plated metal distribution. This process also requires less media than barrel plating to reduce costs even further.
SBE plating offers many advantages over previous plating processes and has enabled the electronics industry to miniaturize their products to improve consumer electronics, medical devices, and scientific instrumentation.