Tri-M3™ (Tri-Alloy, Tri-Metal or White Bronze) Plating
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Ever the innovator, Electro-Spec, Inc.'s engineering team identified a need for a plating process that would enhance the performance of RF connectors. What they developed was the TRI-M3™ (Tri-Alloy, Tri-Metal or White Bronze) finish; this cutting edge process represents a dramatic improvement in plating RF connectors.
The TRI-M3™ process provides high corrosion and tarnish resistance, with a shelf life that far exceeds traditional silver plating, with superior electrical performance than nickel. This new plating method overcomes the negative characteristics of silver and nickel plating, while enhancing their positive properties. Silver exhibits excellent electrical properties but tends to tarnish and breaks down over time, while nickel provides a longer shelf life and wear characteristics, but exhibits poor intermodulation performance, high permeability, and poor screening effects.
TRI-M3™ coated connectors overcome these drawbacks while providing excellent corrosion resistance (even in harsh environments), and low surface friction that is approximately 70% of silver. It also imparts high conductivity, superior abrasion resistance, excellent solderability, low internal stress which allows for forming of plating components, and much more.
For more information on this cutting edge plating process, contact Electro-Spec directly.
Additional Information about Tri-M3™ Plating
Electro-Spec’s Tri-M3™ precision plating process offers electronic component manufacturers an option to traditional nickel or silver plating. Tri-M3™ is a metal alloy coating made of copper, nickel, and zinc that provides a bright white finish and is a superior substitute for nickel and silver in almost all applications.
By combining metals to form an alloy, there is greater design freedom over using a single plating material. An alloy is able to bring together the best characteristics of each metal to create a customized set of properties while eliminating unwanted ones. Tri-M3™ offers a coating that meets governmental and environmental requirements while providing consistent and high-quality results.
The Tri-M3™ coating offers many advantages over nickel or silver materials; it has excellent leveling and solderability characteristics and is lead free. Tri-M3™ can be soldered with or without flux depending on the age of the deposit. Even parts with significant age on them can be easily soldered using standard Sn/Pb solder.
Components coated with Tri-M3™ require a very thin deposit layer to protect the base metal resulting in tighter tolerances of finished parts. This thin layer also produces a coating that provides extreme abrasion resistance and hardness that is twice as hard as silver and comparable to nickel.
Electronic components benefit from low intermodulation and electrical resistance properties of Tri-M3™. Since it is nonmagnetic and has a low porosity, Tri-M3™ exhibits very favorable intermodulation characteristics as compared to standard nickel platings. With high-temperature resistance and durability, this coating is an excellent material for medical applications; it has the ability to withstand corrosion during high temperature sanitation and does not corrode in salt spray, humidity, or when exposed to caustic chemicals while maintaining a very high level of precision and consistency.
Since copper is a core component of Tri-M3™, the need for a copper underplate is eliminated. It can be used as an underplate to silver or gold or as a standalone finish. Also, Tri-M3™ offers cost-effectiveness as well as a longer shelf life than silver.
Electro-Spec has developed a proven, tightly controlled method for applying Tri-M3™ that results in components featuring precise, consistent, and high quality plating.