Electro-Spec’s innovative methods for plating include a technological advancement known as “SAM’s”. SAM’s technology or “Self Assembled Molecules” is an advanced plating method that offers enhanced corrosion and contact resistance, with excellent solderability. Electro-Spec, Inc. developed this innovative plating method which delivers 35% to 75% reduction in precious metal cost while providing equal or superior performance.
This process employs bi-functional or multi-functional molecules that offer two . . . or more . . . termination groups with different functionality. Typically one end is attached to a specific surface while the other end provides specific functionality. In explanation, the process consists of a surface treatment (post plate) that forms a protective layer of “Self Assembled Molecules” on gold, silver, and other non-precious metal-plated surfaces. This process allows for precious metal thickness reduction providing significant cost savings through enhanced corrosion, diffusion, and wear resistance for electronic applications.