Electro-Spec’s innovative methods for plating include a technological advancement known as “SAM’s”. SAM’s technology or “Self Assembled Molecules” is an advanced plating method that offers enhanced corrosion and contact resistance, with excellent solderability. Electro-Spec, Inc. developed this innovative plating method which delivers 35% to 75% reduction in precious metal cost while providing equal or superior performance.

This process employs bi-functional or multi-functional molecules that offer two . . . or more . . . termination groups with different functionality. Typically one end is attached to a specific surface while the other end provides specific functionality. In explanation, the process consists of a surface treatment (post plate) that forms a protective layer of “Self Assembled Molecules” on gold, silver, and other non-precious metal-plated surfaces. This process allows for precious metal thickness reduction providing significant cost savings through enhanced corrosion, diffusion, and wear resistance for electronic applications. 

So what is Electro-Spec’s SAM’s Process and Purpose? 
  • A surface treatment (Post Plate) that forms a protective layer of “Self Assembled Molecules” on Gold, Silver and other plated surfaces.
  • Precious metal thickness reduction and significant cost savings through enhanced corrosion, diffusion and wear resistance for electronic applications.
  • Diffusion Barrier to intragranular and transgranular metallic contamination and modification (Cu Migration)
  • Better Solderability
  • Thickness Reduction
  • 35% to 75% precious metal cost reduction with reduced thickness produces  equal or better performance

The cost savings are only part of the benefits of this cutting-edge plating process. SAM’s technology imparts stable contact resistance at interface Inert surface material (resists oxidation). It also provides resistance to the diffusion of base metals, to corrosion via low porosity, and resistance to wear because of its increased lubricity; in addition, SAM’s also delivers higher conductivity.

Major OEMs and customers worldwide have utilized SAM’s to cut cost from their products. Some customers have gone as far as to develop a dedicated specification for reduced gold thickness; it has allowed others to eliminate costly washing processes, and the list goes on. To learn more about this advanced plating process, and how it can pull costs from your electronics manufacturing processes, contact Electro-Spec directly.

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